| PART |
Description |
Maker |
| 21-0057 |
PACKAGE OUTLINE, 5L SOT23
|
Maxim Integrated Products
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| 21-0125A |
PACKAGE OUTLINE
|
Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
|
| TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-3 SOT323 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT263 |
Package outline
|
NXP
Philips Semiconductors
|
